| 
                             
                              |  |   
                              | Specification |  | Unit |   
                              |  |  |  |  |   
                              |  | mm |  | inch |   
                              |  |  |  |  |  |   
                              | Layer |  | 100(+) |  | 100(+) |   
                              |  |   
                              | Base Material |  | FR-4Low Dk
 FR-4 High Tg
 |  | FR-4Low Dk
 FR-4 High Tg
 |   
                              |  |   
                              | Min. Thickness |  | 1.6-8.4 |  | 0.063~0.33 |   
                              |  |   
                              | Conductor Width |  | 0.045 |  | 0.0018 |   
                              |  |   
                              | Conductor Space |  | 0.06 |  | 0.0024 |   
                              |  |   
                              | Hole Diameter |  | ¥Õ 0.076 |  | ¥Õ 0.003 |   
                              |  |   
                              | Surface 
                                  Treatment(Hard Gold & Electroless Gold Plating)
 |  | 1.3¥ìm |  | 50¥ì¡± |   
                              |  |   
                              | Pitch |  | 0.2 |  | 0.008 |   
                              |  |   
                              | Etc |  | HPL, 
                                  Back Drill |   
                              |  |  |  | 
                             
                              |  | - 68 Layers - 6.5T
 - IVH
 - 0.4 Pitch
 |  |